The relationship between laser cutting machine material and cutting focus

- Aug 02, 2019-

1. Split the focus on the surface of the workpiece

This method also becomes 0 focal length. It is commonly used in SPC, SPH, SS41 and other workpieces. When used, the focus of the cutting machine is selected close to the surface of the workpiece. The smoothness of the upper and lower surfaces of the workpiece is different. The near-focus cutting surface is relatively smooth, while the lower surface away from the cutting focus appears rough. This mode should be based on the process requirements of the upper and lower surfaces in the actual application.

2. Split the focus inside the workpiece

This method also becomes a positive focal length. When you need to divide the workpiece into stainless steel or aluminum steel, the pattern of cutting points inside the workpiece is often used. However, a bad thing about this method is that the cutting surface is larger than the cutting point on the surface of the workpiece due to the focus principle. At the same time, the cutting airflow required in this mode is large, the temperature is sufficient, and the cutting perforation time is slightly longer. point. Therefore, when the material quality of the workpiece you choose is mainly the quality of the material of stainless steel or aluminum lamp hardness.

3. Split the focus on the workpiece

In this way we also become a negative focal length because the dividing point is not located on the surface of the cutting material nor inside the cutting material, but rather above the cutting material. This method mainly uses material quality with high cutting thickness. The reason why this way is to focus on the top of the cutting material is mainly because the thick plate needs a large cutting width, otherwise the oxygen delivered by the nozzle is very likely to cause insufficientness and the cutting temperature is lowered. But one bad thing about this method is that the cutting surface is rough and not very practical for high precision cutting.